13. November 2014 16:43
While gold is an excellent substrate option for filled vias/plated through holes, copper has become the preferred technology for commercial packaging, hybrid manufacturers, and microelectronics providers.
Copper vias offer better thermal conductivity and higher electrical conductivity for high reliability RF/Microwave and high power applications compared to solid gold filled vias. While the cost of gold has risen at a rate of 300% over past decade, copper continues to be an affordable, highly effective medium for thin film substrates.
API's copper filled vias are manufactured in a MIL-PRF-38534 Class H & K facility and are fired in a nitrogen atmosphere to prevent oxidation. Diameters are available from 0.005" to 0.015" in order to fit customer needs. To learn more about API’s copper filled vias, visit micro.apitech.com/copper-filled-vias or contact us to get a quote.
8. April 2014 16:40
Take a guided tour through API's Thin Film capabilities, including a detailed look at our new Copper Filled Vias, the differences between plated vias vs. filled vias, and much more.